发明名称 |
CMP method and device capable of avoiding slurry residues |
摘要 |
A method for chemical mechanical polishing (CMP) includes a rinsing process performed to clean an orifice of a slurry supplier and other elements of a CMP device. The CMP device includes least one nozzle disposed in the periphery of a base. The function of the nozzle is to spray DI water to the orifice of the slurry supplier so as to prevent slurry residue and clogging.
|
申请公布号 |
US7004820(B1) |
申请公布日期 |
2006.02.28 |
申请号 |
US20050908814 |
申请日期 |
2005.05.26 |
申请人 |
UNITED MICROELECTRONICS CORP. |
发明人 |
TENG CHING-WEN;KAO MING-HSING;LIN CHIN-KUN;CHUA ER-YANG;LAU LEE-LEE |
分类号 |
B24B29/00 |
主分类号 |
B24B29/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|