| 摘要 |
An infrared sensor includes a stem, a thermopile element disposed on a component-mounting surface of the stem, a case for covering the thermopile element, an inner cap that covers the thermopile element in order to shield infrared rays generated by secondary emission from an inside surface of the case, and a thermo-sensing element disposed inside the inner cap. In the infrared sensor, the case includes an infrared ray transmitting window for transmitting infrared rays radiating from an object. The inner cap is thermally coupled to the stem by being disposed on the component-mounting surface of the stem, and includes an opening for passing the infrared rays from the infrared ray transmitting window of the case towards the thermopile element. The thermopile element is disposed inside a recess in the component-mounting surface or so as to be substantially surrounded by a highly thermally conductive substrate disposed on the component-mounting surface.
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