| 摘要 |
Disclosed is an interlayer insulating layer for printed wiring boards which is formed on a base and composed of a curing resin wherein scale-like particles are dispersed. Also disclosed is a printed wiring board which is excellently improved in heat cycle resistance and mounting reliability without lowering heat resistance, electrical insulation, heat dissipation, connection reliability or chemical stability. Further disclosed is a method for manufacturing a printed wiring board which enables to transfer a wiring pattern or a via hole to the interlayer insulating layer easily and accurately by an imprinting method wherein a mold having a projected portion corresponding to the wiring pattern is used. The method does not require an optical transfer method or a complicated etching for forming the wiring pattern or via hole. With this method, a printed wiring board having a very fine wiring pattern which is excellent in insulation reliability and interlayer connection can be easily mass-produced at low cost. |
