Removing structures from a substrate comprises preparing a substrate with the structures to be removed, applying a sacrificial layer, and removing the structures and the sacrificial layer by polishing

摘要

Removing structures from a substrate comprises preparing a substrate with the structures to be removed; applying a sacrificial layer; and removing the structures and the sacrificial layer by polishing. An Independent claim is also included for a process for removing one or more structured layers from a substrate. Preferred Features: The structures are made from a precious metal, especially Pt or Ir, an oxide of a precious metal, a dielectric material or a ferroelectric material. The sacrificial layer is a silicon oxide or silicon nitride layer.