| 摘要 |
The invention concerns a method for fabricating a composite multilayer comprising a stack of layers of electrically conductive material alternating with layers of electrically insulating material, said method comprising the following steps: a) depositing a conductive material, in layer form, on a peel-off surface of a deposit substrate, b) bonding, by applying glue in insulating material, a layer of conductive material deposited on a peel-off surface of a deposit substrate onto a receiving substrate, c) separating, by peeling off, the deposit substrate from the layer of conductive material adhering to the receiving substrate, this separation providing an elementary stack comprising a layer of glue and a layer of conductive material, d) bonding, by applying the glue in insulating material, another layer of the conductive material deposited on a peel-off surface of a deposit substrate, onto the previously obtained elementary stack, e) separating, by peeling off, the deposit substrate from the layer of conductive material adhering to the elementary stack previously obtained, this separation providing a subsequent elementary stack comprising a layer of glue and a layer of conductive material. The method comprises the repetition of steps d) and e) as many times as necessary to obtain a stack having the desired number of elementary stacks. |
