| 摘要 |
A test chuck is configured for assembly with, and to test, semiconductor devices of a large-scale substrate. The test chuck includes a substrate with terminals that are arranged correspondingly to the arrangement of bond pads or other contacts of the semiconductor devices, which have yet to be singulated from the large-scale substrate. The test chuck may be part of a larger wafer-scale testing system, which includes test circuits for testing or stressing the semiconductor devices of a large-scale substrate, as well as features, such as a receptacle, for establishing communication between the test circuits and the terminals of the test chuck. Additionally, such a system may include one or more elements, such as a biasing element, for facilitating communication between terminals of the test chuck and corresponding contacts of the large-scale substrate. Methods for testing or stressing semiconductor devices are also disclosed.
|
