| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wire bonding method by which a direction of bending a wire tip part is controlled freely, by realizing fine pitching and low looping, without any modification of conventional wire bonding apparatus, to improve the reliability of curving bending of the wire tip part. <P>SOLUTION: Before a process of first bonding 12, a wire cut-off process in a process of second bonding 15, immediately before the process of first bonding 12 bends a wire 10 projecting from the tip part of a capillary 6 in a cross direction to form a bent part 11. The process of first bonding 12 consists of a process of bonding the bent part 11 to a pad 2, to form a lower first bonding part 12; and a process of moving the capillary 6 upward and toward wiring 4 and lowering the capillary 6 after this, to connect the wire 10 overlapped on the lower first bonding part 12 to form the first bonding part 14. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
