| 摘要 |
PROBLEM TO BE SOLVED: To provide a device for cooling semiconductor element capable of uniformly cooling a semiconductor element using a simple structure. SOLUTION: A refrigerant is supplied at the center of a heat-transfer plate 41, having the closely adhered semiconductor element 10 from a supply port 43. The refrigerant is made to flow toward a peripheral section radially in opening-shaped flow paths formed of an opening forming plate 54 composed of two thin-plate materials of an opening space plate 53 as a spacer and an opening top plate 52 arranged on the opening space plate 53 and having a small height size. The refrigerant is recovered by a recovery groove 46, that goes around the peripheral section once, and discharged from a discharge opening 47. COPYRIGHT: (C)2006,JPO&NCIPI |
