发明名称 Heat dissipating device with dust-collecting mechanism
摘要 A heat dissipating device comprises a dust-collecting mechanism installed at the air vent passage of a fan, and thus the dust or particles mixed in the airflow of the fan shall be collected on the top of the dust-collecting mechanism; the dust-collecting mechanism can be taken out frequently to remove and clean the collected dust or particles, so that the airflow of the fan can be kept normal and the dust deposited on the surface of the metal fins of a heat sink can be decreased greatly as to normally maximize the heat dissipating efficiency for the heat dissipating device for a long period of time and maintain the heat generating source to operate normally at a permissible temperature.
申请公布号 US2006039113(A1) 申请公布日期 2006.02.23
申请号 US20050048804 申请日期 2005.02.03
申请人 COMPAL ELECTRONICS, INC. 发明人 CHENG CHIH-WEI;TIEN CHI-WEI;CHANG HUI-LIAN
分类号 H05K7/20;G06F1/20;H01L23/427 主分类号 H05K7/20
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