| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate deformation prediction device capable of efficiently predicting warping of a printed wiring board. SOLUTION: In this substrate deformation prediction device 100, an area division processing part 110 divides a substrate to areas of a size according to a wiring pattern density based on Garbor data inputted from an input device 200, an equivalent physical property value calculation processing part 120 calculates an anisotropic physical property value for every wiring direction of each area, and calculates an equivalent physical property value of each divided area based on the calculated anisotropic physical property values. A warping simulation execution processing part 130 predicts the warping of a substrate based on the equivalent physical property values. COPYRIGHT: (C)2006,JPO&NCIPI
|
