发明名称 RESIN COMPOSITION, SUBSTRATE WITH RESIN AND LAMINATED BOARD WITH CONDUCTIVE LAYER
摘要 PROBLEM TO BE SOLVED: To provide a resin composition forming an adhesive layer with a high adhesiveness to a substrate and conductive layer, excellent in flame retardancy, and to provide a substrate with the resin and laminated board with conductive layer. SOLUTION: The invention relates to the laminated board with conductive layer 20 comprising a substrate sheet 22, an adhesive layer (resin layer) 24 and the conductive layer 26 in this order. The adhesive layer 24 in the laminated board with conductive layer 20 comprises the resin composition comprising a polyamideimide containing an alicyclic hydrocarbon group and a thermosetting resin. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006052275(A) 申请公布日期 2006.02.23
申请号 JP20040233761 申请日期 2004.08.10
申请人 HITACHI CHEM CO LTD 发明人 MANSEI YOICHIRO;ITO TOSHIHIKO;NAKAMURA NARUHIRO
分类号 C08L79/08;B32B27/34;C08G18/34;C08G73/14;C08K5/521;C08L101/00 主分类号 C08L79/08
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