| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat sink assembly, with which productivity of a semiconductor package can be improved by suppressing warpage or torsion in a carrier frame. SOLUTION: In a heat sink assembly 20, the width of a thermal conducting path can be controlled arbitrarily by providing, e.g. a plurality of round holes 24a in the part 24 between adjacent heat sinks 21 at approximately regular intervals, thereby reducing the distortion of a carrier frame 22. In this way, since the generation of the warpage or torsion in the carrier frame 22 can be decreased under an environment with higher temperature in an assembly step of a package substrate, peelings or cracks on a printed wiring board 70 can be prevented to improve a production yield. Thus, this can obtain effects of improving the productivity of a semiconductor package 80. |
