| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method and an apparatus for flexibly transferring fluids that can cool a desired hot spot in an electronic device while maintaining the minimum level of pressure drop in a heat exchanger. <P>SOLUTION: As for the heat exchanger and its manufacturing method, there are a contact layer which has been connected to a heat source and configured in a way that fluids can be flowed, a contact layer with an adequate thermal conductivity, and a manifold layer that provides the fluids to the contact layers. It is preferable to configure the manifold in a way that the temperature of the heat source can be evened by cooling the hot spot area of the contact layer. For example, the heat exchanger is provided with multiple fluid ports such as the inlet port and outlet port and the fluid ports are configured vertically and horizontally. The manifold layer circulates the fluids to the hot spot area of a predetermined contact layer of the host spot related contact layers. It is preferable not only to place the heat exchanger between the contact and manifold layers but also to have an intermediate layer for optimally transferring the fluids to the hot spot of the contact layer. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
