发明名称 |
Inter-metal dielectric fill |
摘要 |
An inter-metal dielectric (IMD) fill process includes depositing an insulating nanolaminate barrier layer. The nanolaminate is preferably an oxide liner formed by using an alternating layer deposition process. The layer is highly conformal and is an excellent diffusion barrier. Gaps between metal lines are filled using high density plasma chemical vapor deposition with a reactive species gas. The barrier layer protects the metal lines from shorts between neighboring layers. The resulting structure has substantially uneroded metal lines and an insulating IMD fill.
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申请公布号 |
US2006038293(A1) |
申请公布日期 |
2006.02.23 |
申请号 |
US20040924707 |
申请日期 |
2004.08.23 |
申请人 |
RUEGER NEAL R;HILL CHRIS W;BIAN ZAILONG;SMYTHE JOHN A III |
发明人 |
RUEGER NEAL R.;HILL CHRIS W.;BIAN ZAILONG;SMYTHE JOHN A.III |
分类号 |
H01L23/52;H01L23/48 |
主分类号 |
H01L23/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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