| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed-circuit board, superior in both size stability and heat-resisting properties and capable of allowing desired bending and high-density accommodation inside the chassis of an electronic device. SOLUTION: The printed-circuit board has a bending portion and at least one continuous insulating resin layer, including a fiber-based material, wherein a 180°bend is feasible, when the bending portion is bent at a desired position and the radius of curvature of the bending portion sizes at largest 1 mm, when the bending portion is bent. COPYRIGHT: (C)2006,JPO&NCIPI
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