| 摘要 |
PROBLEM TO BE SOLVED: To provide a plating apparatus for forming an adequate plated film while having a simplified apparatus configuration. SOLUTION: This plating apparatus has a mixing dispersion section 60 to which a CO2 tank 21, a dispersion accelerator tank 41 and a plating solution tank 51 are connected. The mixing dispersion part 60 is connected to a plating tank 61. The plating tank 61 has a pair of electrodes for electrolysis plating placed therein. The mixing dispersion section 60 mixes CO2 sent from the CO2 tank 21 and a dispersion accelerator sent from the dispersion accelerator tank 41 with a plating solution sent from the plating solution tank 51 into a dispersion state to produce a plating dispersion; and continuously passes the plating dispersion to the plating tank 61. In the plating tank 61, electrodes are electrified to carry out plating while the supplied plating dispersion is continuously discharged. COPYRIGHT: (C)2007,JPO&INPIT
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