| 摘要 |
PROBLEM TO BE SOLVED: To improve performance by assuring the area of a current route by soldering a bus bar electrode to a base plate. SOLUTION: A notched part 9 is provided at the base plate 1, and its part is formed as a thin part 2. The bus bar electrode 7 is connected by a solder layer 8 on the thin part 2. A semiconductor element 5 such as, for example, an IGBT, a MOSFET or the like, an insulating board 3 a metal plate 4 and the like are provided on the plate 1. At the operating time of a semiconductor device, a current is supplied to the element 5, for example, via the electrode 7, the plate 1, a metal wire 6 and the like. Accordingly, the current route of a large area can be assured between the plate 1 and the electrode 7. At the soldering time of the electrode 7, releasing of its heat to the overall plate 1 can be suppressed by the part 9, and a soldering work can be efficiently executed. |
