发明名称 |
Thermal interposer for thermal management of semiconductor devices |
摘要 |
A thermal interposer is provided for attachment to the back surface of a semiconductor device so as to give a very low thermal resistance. In one preferred embodiment, the thermal interposer has two plates containing wick structures such as grooves. The thermal interposer is integrated with a semiconductor device so as to form a vapor chamber. In particular, the back surface of the semiconductor chip is in direct contact with the interior sealed volume of the vapor chamber, so as to greatly reduce the thermal resistance from the combination of the chip and the vapor chamber. Further, the upper plate is thermally coupled to a heat-sinking fixture such as a heat sink or a cold plate.
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申请公布号 |
US7002247(B2) |
申请公布日期 |
2006.02.21 |
申请号 |
US20040874297 |
申请日期 |
2004.06.18 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
MOK LAWRENCE S.;COLGAN EVAN G.;LU MINHUA;SHIH DA-YUAN |
分类号 |
H01L23/427;H01L23/48;H01L23/52;H01L29/40 |
主分类号 |
H01L23/427 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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