发明名称 Vacuum-cavity MEMS resonator
摘要 A microelectromechanical (MEMS) resonator with a vacuum-cavity is fabricated using polysilicon-enabled release methods. A vacuum-cavity surrounding the MEMS beam is formed by removing release material that surrounds the beam and sealing the resulting cavity under vacuum by depositing a layer of nitride over the structure. The vacuum-cavity MEMS resonators have cantilever beams, bridge beams or breathing-bar beams.
申请公布号 US7002436(B2) 申请公布日期 2006.02.21
申请号 US20040921383 申请日期 2004.08.19
申请人 INTEL CORPORATION 发明人 MA QING;CHENG PENG;RAO VALLURI
分类号 H03H9/10;B81B7/00;H03H3/007;H03H9/24;H03H9/46 主分类号 H03H9/10
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