发明名称 HEAT-CONDUCTIVE INSULATING POLYCARBONATE-BASED RESIN COMPOSITION AND MOLDING
摘要 PROBLEM TO BE SOLVED: To obtain a polycarbonate-based resin composition that has excellent thermal conductivity, molding processability, slight warpage of molding and excellent surface smoothness, its molding, especially a molding useful for OA (Office Automation), electric/electronic parts, a case body and an internal part of precision equipment part. SOLUTION: The heat-conductive polycarbonate-based resin composition comprises, based on (A) 100 parts wt. of a polycarbonate-based resin, (B)≥1 part wt. and≤40 parts wt. of an aromatic polycarbonate oligomer, (C)≥5 parts wt. and≤40 parts wt. of a graphitized carbon fiber having≥100W/m×K coefficient of thermal conductivity in the length direction and 5-20μm average fiber diameter and (D)≥5 parts wt. and≤100 parts wt. of heat-conductive powder (except boron nitride) having≥10W/m×K coefficient of thermal conductivity and 1-500μm average particle diameter. The molding is obtained by molding the heat-conductive polycarbonate-based resin composition. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007099798(A) 申请公布日期 2007.04.19
申请号 JP20050287627 申请日期 2005.09.30
申请人 MITSUBISHI ENGINEERING PLASTICS CORP 发明人 SHIRAISHI YUTAKA;NAGASHIMA HIROMITSU;ISHII KAZUHIKO;NAKANO HIROSHI
分类号 C08L69/00;C08K3/04;C08K3/22;C08K3/28;C08K3/34;C08K3/38;C08K7/06;C08K9/02;C08L67/02 主分类号 C08L69/00
代理机构 代理人
主权项
地址
您可能感兴趣的专利