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发明名称
STACK TYPE SEMICONDUCTOR CHIP PACKAGE HAVING HOLDER FOR PREVENTING DELAMINATION AND SEMICONDUCTOR MODULE COMPRISING THE SAME
摘要
申请公布号
KR20060015919(A)
申请公布日期
2006.02.21
申请号
KR20040064310
申请日期
2004.08.16
申请人
SAMSUNG ELECTRONICS CO., LTD.
发明人
LEE, DONG CHUN;KIM, BYUNG MAN;YU, KWANG SU;SHIN, DONG WOO;LEE, YOUNG SOO
分类号
H01L23/12;H01L23/50
主分类号
H01L23/12
代理机构
代理人
主权项
地址
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