发明名称 Positively photosensitive resin composition and method of pattern formation
摘要 The present invention provides a positive photosensitive resin composition which can be developed with a tetramethylammonium hydroxide aqueous solution with a usual concentration, has high sensitivity and excellent resolution, and is excellent in heat resistance, planarization properties, transparency, low water absorption or the like. Further, the present invention provides a method for arbitrarily forming a pattern having a semicircular or trapezoidal section by using the composition. The positive photosensitive resin composition of the present invention comprises an alkali-soluble resin, a 1,2-quinone diazide compound, a crosslinking compound having at least two epoxy groups and a surfactant, and the alkali-soluble resin is a copolymer comprising a carboxylic group-containing acrylic monomer, a hydroxyl group-containing acrylic monomer and an N-substituted maleimide as essential components. By changing the postbake conditions, the composition can arbitrarily form a pattern having a semicircular or trapezoidal section.
申请公布号 US7001705(B2) 申请公布日期 2006.02.21
申请号 US20040510704 申请日期 2004.10.15
申请人 NISSAN CHEMICAL INDUSTRIES, LTD. 发明人 HATANAKA TADASHI;NIHIRA TAKAYASU
分类号 G03F7/023;G03C1/76;G03F7/00;G03F7/022;G03F7/039;G03F7/30;G03F7/40 主分类号 G03F7/023
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