| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a sensor chip having a substrate, a cover layer, and a spacer layer sandwiched between the substrate and the cover layer, having a hollow reaction part between the substrate and the cover layer, and not causing a warp accompanying a change of temperature or humidity of environment, and to provide a production method for the sensor chip. <P>SOLUTION: This sensor chip has the substrate, the cover layer, and the spacer layer sandwiched between the substrate and the cover layer, and has the hollow reaction part between the substrate and the cover layer, and a detection means inside the hollow reaction part. The substrate and the cover layer have the same material and thickness, and material and shape of the spacer layer are symmetric to a plane parallel to the substrate, and being at an equal distance from the substrate and the cover layer. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
