METHOD FOR MANUFACTURING ELECTRONIC DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a method for manufacturing an electronic device which can reduce a manufacturing cost, in the electronic device equipped with an IC chip and an electrical circuit electrically connected with the IC chip.

SOLUTION: This method for manufacturing the electronic device 1 equipped with the IC chip 2 and the electrical circuit 3 comprises the following processes: a process to form the electrical circuit 3 by blanking a sheet including a conductive material; a process to arrange the IC chip 2 on the electrical circuit 3 so as to allow a terminal part of the IC chip 2 to come into contact with a terminal part of the electrical circuit 3; and a process to insulate the IC chip 2 and the electrical circuit 3 for protection by wrapping the electrical circuit 3 where the IC chip 2 is arranged using an insulating sheet, sealing the electrical circuit 3 by a vacuum lamination process, and pressing the terminal part of the IC chip 2 into contact with the terminal part of the electrical circuit 3.

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