发明名称 |
Thermoelectric heat dissipation device fabricating method, involves adhering thermoelectric semiconductive unit to be sandwiched between base plate and heat sink so that P-N posts are electrically connected with conductive lines |
摘要 |
<p>The method involves providing a base plate (1) with a surface patterned with a set of conductive lines. A heat sink (3) having a patterned surface is provided with another set of conductive lines. A thermoelectric semiconductive unit is adhered to be sandwiched between the base plate and the heat sink so that a set of P-N posts of the semiconductive unit are electrically connected with the conductive lines respectively. An independent claim is also included for a thermoelectric heat dissipation device comprising a thermoelectric semicondutive unit.</p> |
申请公布号 |
DE102004034937(A1) |
申请公布日期 |
2006.02.16 |
申请号 |
DE20041034937 |
申请日期 |
2004.07.20 |
申请人 |
WAFFER TECHNOLOGY CORP., TAOYUAN;WANG, JACK |
发明人 |
WANG, JACK;LIN, MICHAEL;MA, CHARLES |
分类号 |
G06F1/20;H01L23/34;H01L35/32;H01L35/34;H05K7/20 |
主分类号 |
G06F1/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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