发明名称 THERMOELECTRIC MODULE
摘要 PROBLEM TO BE SOLVED: To provide a technique to raise an adhesiveness among each layer when titanium layers or titanium alloy layers are provided between a thermoelement and an electrode. SOLUTION: There are provided p-type or n-type thermoelements 50, 60; electrodes 71, 72, 73 bonded to the p-type or n-type thermoelements 50, 60; and interlayers provided between the p-type or n-type thermoelements 50, 60; and the electrodes 71, 72, 73. This interlayer is provided with titanium layers 83, 84, 93, 94 or the titanium alloy layers which are formed on the electrodes 71, 72, 73; and aluminum layers 81, 82, 91, 92 or an aluminum alloy layers which are provided among the titanium layers 83, 84, 93, 94, or the titanium alloy layers and the thermoelements 50, 60. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006049736(A) 申请公布日期 2006.02.16
申请号 JP20040231863 申请日期 2004.08.09
申请人 KOMATSU LTD 发明人 KANDA TOSHIO;UMIBE HIROMASA;TOMITA KENICHI;SANO SEIJIRO
分类号 H01L35/08;H01L35/32;H02N11/00 主分类号 H01L35/08
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