发明名称 |
Metal-metal bonding of compliant interconnect |
摘要 |
Embodiments of the invention provide a first component with a compliant interconnect bonded to a second component with a land pad by a metal to metal bond. In some embodiments, the first component may be a microprocessor die and the second component a package substrate.
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申请公布号 |
US2006033172(A1) |
申请公布日期 |
2006.02.16 |
申请号 |
US20040917041 |
申请日期 |
2004.08.11 |
申请人 |
MUTHUKUMAR SRIRAM;RAMANATHAN SHRIRAM |
发明人 |
MUTHUKUMAR SRIRAM;RAMANATHAN SHRIRAM |
分类号 |
H01L29/76 |
主分类号 |
H01L29/76 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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