| 发明名称 |
POLYAMIDE ADHESIVE AND ARTICLES INCLUDING THE SAME |
| 摘要 |
A hot melt adhesive composition that includes thermoplastic polyamide, adhesion promoter that includes at least one acid group, and wax having a melting point greater than 82°C. |
| 申请公布号 |
WO2006017784(A1) |
申请公布日期 |
2006.02.16 |
| 申请号 |
WO2005US27983 |
申请日期 |
2005.08.04 |
| 申请人 |
H.B. FULLER LICENSING & FINANCING, INC.;MILLER, RICHARD, A. |
发明人 |
MILLER, RICHARD, A. |
| 分类号 |
(IPC1-7):C09J177/00 |
主分类号 |
(IPC1-7):C09J177/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
