发明名称 MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To solve a conventional problem of occurrence of a junction leak current between a collector and a base due to crystal defect of a slot end adjoining a base region. SOLUTION: An opening 17 is so formed on a silicon oxide film 15 and a TEOS film 16 as to allow separation distance t1 from an upper end part 18 of a slot part 8. The opening 17 is utilized to form a base taking-out electrode 21. An external base region 19 is formed from the base taking-out electrode 21 by solid-phase diffusion. Here, a separation distance t2 is allowed between the external base region 19 and the upper end 18 of the slot part 8. By this manufacturing method, occurrence of junction leak current between a collector and a base is suppressed. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006049685(A) 申请公布日期 2006.02.16
申请号 JP20040230638 申请日期 2004.08.06
申请人 SANYO ELECTRIC CO LTD 发明人 KOUCHI SATOSHI;OKUDA TOSHIHIRO
分类号 H01L21/76;H01L21/331;H01L29/732 主分类号 H01L21/76
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