发明名称 Power gridding scheme
摘要 An electrical device includes electrical contact pads, a supply voltage bus and an interconnection circuit. The electrical contact pads receive a supply voltage, and the bus is electrically connected to the electrical contact pads. For each electrical contact pad, the interconnection circuit forms a redundant connection between the bus and the electrical contact pad. The electrical device may include a passivation layer that includes windows to establish electrical contact between the electrical contact pads and the supply voltage bus. This window may be elongated in a path that is generally aligned with the path along which the supply voltage bus extends.
申请公布号 US2006033197(A1) 申请公布日期 2006.02.16
申请号 US20050203724 申请日期 2005.08.15
申请人 INTEL CORPORATION 发明人 SESHAN KRISHNA
分类号 H01L23/52;H01L21/44;H01L23/485;H01L23/50 主分类号 H01L23/52
代理机构 代理人
主权项
地址