发明名称 SUBSTRATE HOLDER HAVING A FLUID GAP AND METHOD OF FABRICATING THE SUBSTRATE HOLDER
摘要 A substrate holder (20) for supporting a substrate (30). A heating component (50) is positioned adjacent to a supporting surface and between the supporting surface and a cooling component (60). A fluid gap is positioned between the cooling component and the heating component, the fluid gap configured to receive a fluid to increase thermal conduction between the cooling component and the heating component. A brazing material is disposed between the cooling component and the heating component, the brazing material disposed adjacent to the fluid gap.
申请公布号 WO2005074450(A3) 申请公布日期 2006.02.16
申请号 WO2004US39780 申请日期 2004.12.23
申请人 TOKYO ELECTRON LIMITED;HAMELIN, THOMAS 发明人 HAMELIN, THOMAS
分类号 C23C16/458;C23C16/46;H01L21/00 主分类号 C23C16/458
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