发明名称 |
SUBSTRATE HOLDER HAVING A FLUID GAP AND METHOD OF FABRICATING THE SUBSTRATE HOLDER |
摘要 |
A substrate holder (20) for supporting a substrate (30). A heating component (50) is positioned adjacent to a supporting surface and between the supporting surface and a cooling component (60). A fluid gap is positioned between the cooling component and the heating component, the fluid gap configured to receive a fluid to increase thermal conduction between the cooling component and the heating component. A brazing material is disposed between the cooling component and the heating component, the brazing material disposed adjacent to the fluid gap. |
申请公布号 |
WO2005074450(A3) |
申请公布日期 |
2006.02.16 |
申请号 |
WO2004US39780 |
申请日期 |
2004.12.23 |
申请人 |
TOKYO ELECTRON LIMITED;HAMELIN, THOMAS |
发明人 |
HAMELIN, THOMAS |
分类号 |
C23C16/458;C23C16/46;H01L21/00 |
主分类号 |
C23C16/458 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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