Flip-chips on flex substrates, flip-chip and wire-bonded chip stacks, and methods of assembling same

摘要

A flip-chip is mounted on a flex substrate. A flip-chip is mounted on a flex substrate, and a wire-bond chip is mounted on the flip-chip. A packaged flip-chip die is coupled to the flex substrate. A computing system is also disclosed that includes the flip-chip on a flex substrate configuration.