WAFER GUIDE AND WAFER CLEANING APPARATUS USED THE SAME
摘要
A wafer guide is provided to avoid a defect of solution fluidity by making the cleaning solution flow near a wafer mounted on a wafer guide. Wafer support panel parts(126) protrude from both lateral surfaces of a lower panel part. A slot part(128) holds the edge region of a wafer, positioned in the upper end of the wafer support panel part. A cleaning solution suck hole(130) sucks a cleaning solution flowing near the surface of the wafer, installed in the sidewall of the slot part. The cleaning solution sucked by the cleaning solution suck hole is exhausted to the outside by a cleaning solution drain line(132). A plurality of wafer support panel parts can lengthwise be installed in parallel with each other on both the lateral surfaces of the lower panel part.
申请公布号
KR20080088705(A)
申请公布日期
2008.10.06
申请号
KR20070031260
申请日期
2007.03.30
申请人
SAMSUNG ELECTRONICS CO., LTD.
发明人
KIM, KI SANG;NAM, CHANG HYEON;AHN, DUK MIN;CHOI, KYUE SANG