发明名称 Method and device for mounting electronic component
摘要 <p>In a component mounting device in which a component is picked up and mounted on a circuit board by a suction nozzle, an amount of displacement between a center position of the suction nozzle (11) and that of the picked-up component (12) is measured, and when it is larger than a preliminarily determined value, a warning is generated indicating that the parts cassette (3) from which the component (12) has been fed is in abnormal condition, as well as the mounting action of the component (12) is stopped.</p>
申请公布号 EP0891129(B1) 申请公布日期 2006.02.15
申请号 EP19980305354 申请日期 1998.07.06
申请人 MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 发明人 HIRANO, MASATO;SAKAI, YOSHINORI;NAKASHIMA, TATEO
分类号 H05K13/08;H05K13/04 主分类号 H05K13/08
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