发明名称 VAPOR DEPOSITION SOURCE AND VAPOR DEPOSITION APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a vapor deposition apparatus which accurately vaporizes a required quantity of an organic material by heating. SOLUTION: An introduction pipe 31 has a portion (an introduction portion 44) which is inserted into the inner part of a vapor deposition chamber 21, and an outer periphery of the portion is formed from a low-resistance material which contains copper as a main component. The lower end of a rotary shaft 35 is positioned in the inside of the introduction portion 44. When an electromagnetic field is formed in the inner part of the vapor deposition chamber 21, a high-temperature body 22 is induction-heated, but the introduction pipe 31 and the rotary shaft 35 are not induction-heated. Accordingly, an organic material 39 which moves through an open hole 33 of the introduction pipe 31 is not melted or vaporized, so that the organic material 39 does not clog the hole. Accordingly, a desired quantity of the organic material 39 can be accurately arranged in the high-temperature body 22. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009084674(A) 申请公布日期 2009.04.23
申请号 JP20070271252 申请日期 2007.10.18
申请人 ULVAC JAPAN LTD 发明人 NEGISHI TOSHIO
分类号 C23C14/24;H01L51/50;H05B33/10 主分类号 C23C14/24
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