发明名称 |
High performance RF inductors and transformers using bonding technique |
摘要 |
A method of fabricating an inductor using bonding techniques in the manufacture of integrated circuits is described. Bonding pads are provided over a semiconductor substrate. Input/output connections are made to at least two of the bonding pads. A plurality of wire bond loops are made between each two of the bonding pads wherein the plurality of wire bond loops forms the inductor.
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申请公布号 |
US6998953(B2) |
申请公布日期 |
2006.02.14 |
申请号 |
US20050095268 |
申请日期 |
2005.03.31 |
申请人 |
CHARTERED SEMICONDUCTOR MANUFACTURING LTD. |
发明人 |
YEO KIAT SENG;IAN HAI PENG;MA JIANGUD;DO MANH ANH;CHEW JOHNNY KOK WAI |
分类号 |
H01F5/00;H01F17/00;H01F41/04;H01L23/522;H01L23/64 |
主分类号 |
H01F5/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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