| 发明名称 |
Apparatus and method for heating micro-components mounted on a substrate |
| 摘要 |
A package for heating a micro-component is disclosed. The package comprises a platform having a resistive heating element integral with the platform. The package further includes a micro-component disposed on the platform.
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| 申请公布号 |
US6998587(B2) |
申请公布日期 |
2006.02.14 |
| 申请号 |
US20030739242 |
申请日期 |
2003.12.18 |
| 申请人 |
INTEL CORPORATION |
发明人 |
KIRKPATRICK PETER E.;FINOT MARC |
| 分类号 |
H05B3/06;H05B3/26;H05B3/28 |
主分类号 |
H05B3/06 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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