| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an exposure drawing system for easily evaluating the improvement degree of mask correction without influenced by production variance for each semiconductor wafer. <P>SOLUTION: The system is equipped with: an inspection information memory device 4 to store inspection information relating to a wafer for initial inspection manufactured by using an initial mask; a manufacturing unit 2 to manufacture wafer for correction inspection in a series of process including a lithographic step of exposing a correction mask chip region using a correction mask prepared by correcting the initial mask based on the inspection information and an initial mask chip region using the initial mask, these regions adjacent to each other on one semiconductor wafer; an inspecting unit 5 to inspect the initial mask chip region and the correction mask chip region after the series of process; and an evaluating unit 6 to evaluate the improvement degree of the correction mask with respect to the initial mask by comparing the respective inspection results of the initial mask chip region and the correction mask chip region. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
