| 摘要 |
PROBLEM TO BE SOLVED: To provide a film probe manufacturing method suitable for inspecting semiconductors and display devices especially of an fine pitch. SOLUTION: In a layered product, both a supporting substrate in which a supporting substrate plating layer is formed in the surface and an insulating resin layer having an electrically conductive metal layer on one surface are layered in such a way that the supporting substrate plating layer may be on the inside-layer side and that the electrically conductive metal layer may be on the surface-layer side. Electrode bodies are formed by plating in metal layer openings and openings for electrode body formation provided for the electrically conductive metal layer and the insulating resin layer of the layered product. After removing the supporting substrate and then the supporting substrate plating layer from the layered product, the insulating resin layer is half-etched to protrude parts of the electrode bodies to the surface of the insulating resin layer to be contacts in the film probe manufacturing method. COPYRIGHT: (C)2006,JPO&NCIPI
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