发明名称 Method of manufacturing a semiconductor device with a strained channel
摘要 A method of manufacturing a semiconductor device provides a semiconductor substrate with a gate and a number of source/drain regions on the semiconductor substrate. A layer containing a strain-inducing element is provided over the number of source/drain regions. The strain-inducing element is driven from the layer containing a strain-inducing element into the number of source/drain regions. A number of source/drains is formed in the number of source/drain regions.
申请公布号 US2006030094(A1) 申请公布日期 2006.02.09
申请号 US20040016023 申请日期 2004.12.16
申请人 CHARTERED SEMICONDUCTOR MANUFACTURING LTD. 发明人 CHUI KING J.;SAMUDRA GANESH;YEO YEE C.;LIU JINPING;TEE KHENG C.;PHUA WEE H.;WONG LYDIA
分类号 H01L21/8234 主分类号 H01L21/8234
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