Verfahren zum Löten von Leiterplattern,申请号DE20006013935T-传众专利搜索

首页产品黄页商标征信

会员服务注册登录

法人/股东/高管

发明名称	Verfahren zum Löten von Leiterplattern
摘要
申请公布号	DE60013935(T2)	申请公布日期	2006.02.09
申请号	DE20006013935T	申请日期	2000.02.21
申请人	SENJU METAL INDUSTRY CO., LTD.	发明人	NAKAMURA, HIDEKI;MAWATARI, SHOHEI
分类号	B23K1/00;B23K1/008;B23K1/012;B23K1/08;B23K1/20;B23K3/06;B23K3/08;H05K3/34	主分类号	B23K1/00
代理机构		代理人
主权项
地址

您可能感兴趣的专利

Phosphonate nucleosides useful as active ingredients in pharmaceutical compositions for the treatment of viral infections, and intermediates for their production

Bromodomain inhibitors and uses thereof

Phosphoinositide 3-kinase inhibitor with a zinc binding moiety

Thieno [2, 3-D] pyrimidine derivatives and their use to treat arrhythmia

Tyrosine kinase inhibitors

Bicyclic heteroaromatic compounds

Purifying crude furan 2,5-dicarboxylic acid by hydrogenation

Pyrimidine carboxamide derivatives

Crystalline forms of a biphenyl compound

Isomerized alpha olefin sulfonate and method of making the same

Quick drying polymeric coating

Agrochemical formulations containing a compatibility agent

Aryloxyphenoxypropionic acid herbicide emulsifiable concentrates with non-petroleum derived built-in adjuvant

Transgenic non-human animal comprising a mutant alpha-synuclein

Irrigation systems

Universal drain hole cover for planting containers

Device for pruning plant growth

Method of producing a low twist towel

Liner for a grocery cart