| 摘要 |
Disclosed herein is a laminate for a flexible printed circuit board, which includes a base film, and a tie layer formed of a copper alloy containing a small amount of Zn-V or Zn-Ta disposed on the base film. As such, the tie layer formed of a copper alloy containing Zn-V has a component ratio of Zn in the copper alloy larger than that of V, and preferably, includes more than 2.5% Zn but not more than 5%, and less than 2.5% V. In addition, the tie layer formed of a copper alloy containing Zn-Ta has a component ratio of Zn in the copper alloy larger than that of Ta, and preferably, includes more than 2.5% Zn but not more than 5%, and less than 2.5% Ta.
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