| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer printed wiring board in which laser via process technology is effectively used for high density wiring at a low cost, a manufacturing method thereof, and an electronic device where the multilayer printed wiring board is mounted. SOLUTION: A second layer (L2) used as a power supply or a ground layer and a third layer (L3) used as a signal layer are formed with a core material 12 which is provided with a via 21b that is drilled and plated toward the second layer on an outer layer side from the third layer on an inner layer side. The via 21b forms a circuit connecting between the third layer (L3) which is to be a signal layer and the second layer (L2) which is to be the power supply or ground layer. COPYRIGHT: (C)2006,JPO&NCIPI |
