| 摘要 |
PROBLEM TO BE SOLVED: To provide a small-size thin metal package capable of canceling a trouble due to the thermal expansion of a package with an electronic device housed inside and sealed so as to be air-tight by a lid member, by employing a base member formed of a thin sheet type metal with a ceramics film formed thereon, as a substrate. SOLUTION: The thin metal package is provided with the base member 10 and the lid member 20 obtained by coating the metal thin sheet with a ceramics film, and a quartz piece 30 of the electronic device arranged between both of the members 10, 20 and sealed so as to be air-tight while employing a conductive pattern 12 formed on the base member 10 as an electrode. In this case, the thermal expansion coefficient of the metal sheet for the base member 10 is specified so as to coincide substantially with that of the quartz for the electronic device mounted on the base member 10 while the arrangement of the quartz piece on the base member 10 is ensured to stabilize the characteristics of the metal package. COPYRIGHT: (C)2006,JPO&NCIPI
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