发明名称 LIGHT EMITTING DEVICES AND WIRING BOARD THEREFOR
摘要 <P>PROBLEM TO BE SOLVED: To provide a wiring board for light emitting devices excellent in heat dissipation and mounting reliability, and to provide a light emitting device. <P>SOLUTION: The wiring board for light emitting devices is provided with at least a plate-shaped insulating base 1 composed of fired ceramics burned at low temperature below 1,050&deg;C, conductor layers 3, 5 and 7 formed at least in one side of the surface or the inside of this insulating base 1, and a mounting part 9 for mounting the light emitting device 21 in one principal surface of the insulating base 1. <P>COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006041230(A) 申请公布日期 2006.02.09
申请号 JP20040219779 申请日期 2004.07.28
申请人 KYOCERA CORP 发明人 IZUMI MINAKO;HASEGAWA TOMOHIDE;SASAKI YASUHIRO
分类号 H01L33/44;H01L33/56;H01L33/62;H01L33/64 主分类号 H01L33/44
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