| 摘要 |
PROBLEM TO BE SOLVED: To prevent a photoresist which is used as a spacer between an air bridge and a ceramic substrate when forming the air bridge, from being created as a residue after the air bridge is formed. SOLUTION: A gold wiring pattern is formed on a substrate, the wiring pattern is covered with a copper metal layer, an aperture is then provided on the metal layer by photolithography, and a wiring pattern surface is exposed. A photoresist is formed around the metal layer provided between apertures, and air bridge wiring is plated on the metal layer between the wiring pattern and the aperture. The photoresist is removed, the metal layer is then dissolved by an aqueous solution of persulfuric acid soda (NaSO<SB>3</SB>-O-O-O<SB>3</SB>SNa), and air bridge wiring is formed. COPYRIGHT: (C)2006,JPO&NCIPI
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