| 摘要 |
PROBLEM TO BE SOLVED: To provide an etching system capable of etching the circumferential edge portion of a semiconductor wafer surely. SOLUTION: The etching system comprises a holding/driving mechanism 1 for rotary driving a semiconductor wafer W in the peripheral direction while inclining such that the device surface d<SB>2</SB>becomes the underside in the inclining direction, and a control member 24 provided at a position corresponding to the lower end of the semiconductor wafer held by the holding/driving mechanism while opposing the outer circumferential part of the substrate and the peripheral part of a liquid receiving part 24a being supplied with etching liquid and the device surface of the substrate and having a portion 24b for introducing the etching liquid supplied to the liquid receiving part to the circumferential edge part of the device surface d<SB>2</SB>of the semiconductor wafer by surface tension. COPYRIGHT: (C)2006,JPO&NCIPI
|
