| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a bump electrode in which solder wettability is improved. <P>SOLUTION: The bump electrode 10 is constituted of a core 12 arranged on the substrate 11, and a solder layer 13 arranged on the surface 20 of the core 12. The surface 20 of the core 12 is provided with a side surface 21 which is in contact with the substrate 11, an upper surface 22 positioned above the side surface 21, and a beveling surface 23 located in border between the upper surface 22 and the side surface 21. In the bump electrode 10, since the corner of the conventional core is worked in the beveling surface 12, solder wettability resulting from profile is improvable. As a result, melting solder of the side surface 21 simply overcomes the beveling surface 12 and spreads to the upper surface 22, so that amount of solder of the upper surface 22 is fully assured. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
