| 摘要 |
<P>PROBLEM TO BE SOLVED: To suppress the occurrence of irregularities at a via conductor part of a ceramic wiring board which is sintered by suppressing contraction characteristics in X-Y axis direction, allowing formation of a flat surface, resulting in suppressed occurrence of defective IC which is mounted. <P>SOLUTION: The ceramic wiring board comprises an insulating substrate 2 where a plurality of insulating layers 2a-2e are laminated, a flat conductor pattern 3 formed on the surface as well as inside the insulating substrate 2, a via conductor 8 so formed as to penetrate almost vertically from the surface to the backside of the insulating substrate 2. The diameter of a via conductor 8a positioned on the surface side of the insulating substrate 2 is smaller than that of a via conductor 8b positioned on the inside of the insulating substrate. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
