| 摘要 |
PROBLEM TO BE SOLVED: To solve such a problem that the softening melting temperature of a sealant for joining an insulating substrate with a cover is too high of approx. 400°C, so that a heat melting the sealant works on an electronic component housed in a container, resulting in the degraded characteristic of the electronic component. SOLUTION: The container 4 for housing an electronic component is comprised of an insulating substrate 1 to mount an electronic component 3 to its upper surface, and a cover 2 that is joined with the upper surface of the insulating substrate 1 by means of a sealant 8 and hermetically houses the electronic component 3 in a space between the insulating substrate 1 and itself. The sealant 8 contains a glass component containing a vanadium pentoxide of 25-35 mass%, a tellurium dioxide of 30-40 mass%, a barium oxide of 15-25 mass%, molybdenum oxide of 5-10 mass%, zinc oxide of 1-10 mass%, aluminum oxide of 0.1-2 mass%, and silicon oxide of 0.1-2 mass%, to which a zirconium silicate of 40-60 pts. is externally added as a filler when the glass component is 100 mass pts. COPYRIGHT: (C)2006,JPO&NCIPI
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